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Magazine Name : Ieee Transactions On Electronics Packaging Manufacturing
Year : 2002Volume number : 25Issue:03
Interfacial Reaction Studies On Lead (Pb)-Free Solder Alloys(Article) Subject:
Dissolution
Author:
Joowoon
Kang
page:
155
-
161
Interfacial Reactions Between Lead-Free Snagcu Solder And Ni(P) Surface Finish On Printed Circuit Boards(Article) Subject:
Interface
Author:
G. T.
Zheng
page:
162
-
167
Wetting Characteristics Of Pb-Free Solder Alloys And Pwb Finishes(Article) Subject:
Soldering Error
Author:
J
Dang
page:
168
-
184
Microstructure, Joint Stength And Failure Mechanisms Of Snpb And Pb-Free Solders In Bga Packages(Article) Subject:
Activation Energy
Author:
M
Li
page:
185
-
192
Pb-Free Sn/3.5 Ag Electroplating Bumping Process And Under Bump Metallization (Ubm)(Article) Subject:
Electric Drive
Author:
Y
Jang
page:
193
-
202
Time Series Modeling Of Photosensitive Polymers Development Rate For Via Formation Applications(Article) Subject:
Mcmc
,
Neural Network
Author:
A
Kim
page:
203
-
209
Reliabilty Investigation Ofhard Core Solder Bumps Using Mechanical Palladium And Snpb Solder(Article) Subject:
Flip Chi P
Author:
I
Opperemann
page:
210
-
216
Mechanical Fatigue Test Method For Chip/ Underfill Declamination In Flip-Chip Packages(Article) Subject:
Flip Chi P
,
Fatigue
Author:
Kenji
Hirohata
page:
217
-
222
Comprehensive Treatment Of Moisture Induced Failure-Recent Advances(Article) Subject:
Finite Element
Author:
P.S
Wong
page:
223
-
230
Characteristics And Reliabity Of Fast-Flow, Snap-Cure, And Reworkable Underfills For Solder Bumped Flip Chip On Low-Cost Sustrates(Article) Subject:
Reliability
Author:
K. K
Lau
page:
231
-
239